Duisburg, Germany

Mohamed Tohfa


Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2011-2015

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4 patents (USPTO):Explore Patents

Title: Innovations of Inventor Mohamed Tohfa

Introduction

Mohamed Tohfa is a notable inventor based in Duisburg, Germany. He has made significant contributions to the field of manufacturing, particularly in the production of hollow profiles and structured profiles. With a total of four patents to his name, Tohfa's work showcases his innovative approach to engineering and design.

Latest Patents

Tohfa's latest patents include a method and device for the coreless forming of hollow profiles. This method involves producing a hollow section from a blank, which is introduced between two coreless halves of a die. These halves can be displaced relative to one another, allowing the blank to be formed into a slotted hollow section. The design includes features that prevent the edges of the blank from sliding ahead during the closing movement of the die. Additionally, he has developed a device for manufacturing profiles from a sheet, which includes at least one work station with a base plate and two die halves. This device is designed to produce heavily structured profiles with high flexibility and economic efficiency.

Career Highlights

Throughout his career, Mohamed Tohfa has worked with prominent companies such as Thyssenkrupp Steel AG and Thyssenkrupp Steel Europe AG. His experience in these organizations has contributed to his expertise in manufacturing processes and innovations.

Collaborations

Tohfa has collaborated with notable colleagues, including Michael Brüggenbrock and Thomas Flehmig. These partnerships have likely enhanced his work and contributed to the development of his patents.

Conclusion

Mohamed Tohfa's contributions to the field of manufacturing through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.

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