This inventor holds 2 USPTO granted patents. Top assignees: Qpl Limited, Quality Platers Limited. Active years: 2003-2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2003-2004
Title: Innovations of Mohamed Lebbai Moosa Naina
Introduction
Mohamed Lebbai Moosa Naina is an accomplished inventor based in Hong Kong, CN. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His innovative approaches have enhanced the efficiency and effectiveness of automated wire bonding processes.
Latest Patents
One of his latest patents is focused on a leadframe designed for enhanced downbond registration during the automatic wire bond process. This invention aims to improve the visual detectability of a leadframe that includes a die attach pad and multiple contacts. The leadframe features at least one of a ring, a line, and an array of dots plated on the die attach pad and around its periphery. Additionally, the leadframe undergoes surface treatment to induce a color change, enhancing the visual detectability of these features.
Career Highlights
Throughout his career, Mohamed has worked with notable companies such as Quality Platers Limited and QPL Limited. His experience in these organizations has contributed to his expertise in the field of integrated circuit technology.
Collaborations
He has collaborated with various professionals, including his coworker Yung Piu Lau, to further advance his innovative projects.
Conclusion
Mohamed Lebbai Moosa Naina's contributions to the field of integrated circuit packaging through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in automated wire bonding processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile