Seattle, WA, United States of America

Mohamed Azdamou

USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2024

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations of Mohamed Azdamou

Introduction

Mohamed Azdamou is an accomplished inventor based in Seattle, Washington. He has made significant contributions to the field of adhesive bonding through his innovative patent. His work is particularly relevant in industries where strong and reliable bond joints are essential.

Latest Patents

Azdamou holds a patent for a method titled "Double vacuum and positive pressure for paste bond joints." This innovative method eliminates voids in the bond line and manipulates the thickness of the bond line. The process involves applying an adhesive at the center of an area of a structure, placing a doubler on the adhesive, and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure to purge entrapped gases. This technique effectively controls the thickness of the bond line at the peripheral edge of the doubler.

Career Highlights

Mohamed Azdamou is currently employed at The Boeing Company, where he applies his expertise in adhesive bonding. His work contributes to the development of advanced aerospace technologies, ensuring the integrity and performance of aircraft structures.

Collaborations

Azdamou collaborates with various professionals in his field, including his coworker John F Spalding. Their combined efforts enhance the innovation and application of bonding techniques within the aerospace industry.

Conclusion

Mohamed Azdamou's contributions to adhesive bonding through his patented method demonstrate his commitment to innovation in the aerospace sector. His work not only advances technology but also sets a standard for future developments in bonding techniques.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…