The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 18, 2024
Filed:
Aug. 09, 2021
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
John F. Spalding, Seattle, WA (US);
Mohamed Azdamou, Seattle, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 73/04 (2006.01); B29C 65/00 (2006.01); B29C 65/54 (2006.01); B29C 73/24 (2006.01); B29L 31/30 (2006.01); B64F 5/40 (2017.01);
U.S. Cl.
CPC ...
B29C 73/04 (2013.01); B29C 65/54 (2013.01); B29C 66/82661 (2013.01); B29C 73/24 (2013.01); B29L 2031/3076 (2013.01); B64F 5/40 (2017.01);
Abstract
A method eliminates voids in the bond line and manipulates a thickness of the bond line. This method includes: applying an adhesive at a center of an area of a structure; placing a doubler on the adhesive over the area of the structure, wherein the doubler has a peripheral edge; and maintaining a negative pressure at the peripheral edge of the doubler while simultaneously maintaining a positive pressure at the doubler to purge entrapped gases and control a thickness of the bond line at the peripheral edge of the doubler.