Cupertino, CA, United States of America

Mo C Chan

This inventor holds 1 USPTO granted patent. Top assignee: Apple Inc.. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mo C Chan. Retrieved from https://idiyas.com/inventor/mo-c-chan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Mo C Chan - Innovator in Acoustic Technology

Introduction

Mo C Chan is a notable inventor based in Cupertino, CA, who has made significant contributions to the field of acoustic technology. He is recognized for his innovative approach to reducing acoustic noise in audio modules, which has implications for various audio applications.

Latest Patents

Mo C Chan holds a patent for "Audio modules with fins to reduce acoustic noise due to airflow." This invention provides an acoustic module with integrated fins designed to minimize unwanted noise caused by airflow. The fins help divert airflow resulting from pressure changes due to an oscillating diaphragm, leading to a more uniform airflow distribution within the module. This innovation results in lower peak velocity and reduced noise levels, enhancing the overall audio experience.

Career Highlights

Chan is currently employed at Apple Inc., where he continues to develop cutting-edge technologies. His work focuses on improving audio quality and user experience through innovative designs and engineering solutions.

Collaborations

Mo C Chan collaborates with talented individuals such as Marco Baratelli and Claudio Notarangelo, contributing to a dynamic team that drives innovation at Apple Inc.

Conclusion

Mo C Chan's contributions to acoustic technology exemplify the impact of innovative thinking in enhancing audio experiences. His patent reflects a commitment to solving real-world problems through engineering and design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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