This inventor holds 1 USPTO granted patent. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1994
Title: Mitsuya Hashii: Semiconductor Bonding Innovation.
Introduction
Mitsuya Hashii is an inventor associated with Itami, Japan. His patent work addresses precision in mounting semiconductor devices by using laser bonding and lead-recognition controls.
Latest Patents
Hashii is credited with 1 patent: “Laser OLB Apparatus and Method of Mounting Semiconductor Device.” The invention describes an XY table, a bonding laser that joins substrate bonding lands to semiconductor-device leads, and a recognition device that checks whether the leads are free of flexure and deviation. A control unit permits bonding only after the recognition device confirms that the leads meet those conditions.
Career Highlights
Hashii is associated with Mitsubishi Electric Corporation, the English name commonly used for Mitsubishi Denki Kabushiki Kaisha. His patent reflects work on improving the accuracy and reliability of semiconductor-device assembly.
Collaborations
Haruo Shimamoto and Hideya Yagoura are identified as Hashii’s coworkers. Their shared professional context connects them to the semiconductor and electronics innovation environment surrounding his work.
Conclusion
Mitsuya Hashii’s patent presents a controlled laser-bonding approach that checks lead alignment before joining semiconductor components, highlighting his contribution to precision device assembly.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile