Yamaguchi, Japan

Mitsutoshi Hikasa

This inventor holds 2 USPTO granted patents. Top assignee: Tokuyama Corporation. Active years: 1998-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsutoshi Hikasa. Retrieved from https://idiyas.com/inventor/mitsutoshi-hikasa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 16(Granted Patents)


Location History:

  • Fujisawa, JP (1998)
  • Yamaguchi-ken, JP (2002)

Company Filing History:


Years Active: 1998-2002

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2 patents (USPTO):Explore Patents

Title: Mitsutoshi Hikasa: Innovator in Substrate Technology

Introduction

Mitsutoshi Hikasa is a notable inventor based in Yamaguchi-ken, Japan. He has made significant contributions to the field of substrate technology, holding a total of 2 patents. His work has been instrumental in advancing the production processes within this specialized area.

Latest Patents

Hikasa's latest patents include innovations such as "Substrate and process for producing the same" and "Submount." These patents reflect his commitment to enhancing the efficiency and effectiveness of substrate production.

Career Highlights

Mitsutoshi Hikasa is currently employed at Tokuyama Corporation, where he continues to develop and refine his innovative ideas. His role at the company allows him to collaborate with other talented professionals in the field.

Collaborations

Hikasa has worked alongside notable colleagues such as Yoshihiko Numata and Reo Yamamoto. Their combined expertise contributes to the success of their projects and the advancement of technology in their industry.

Conclusion

Mitsutoshi Hikasa is a distinguished inventor whose work in substrate technology has led to valuable patents and collaborations. His contributions continue to shape the future of this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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