Hyogo, Japan

Mitsuo Osada

This inventor holds 8 USPTO granted patents. Top assignee: Sumitomo Electric Industries, Limited. Active years: 1984-1996.


% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 101(Granted Patents)


Location History:

  • Itami, JP (1994)
  • Hyogo, JP (1984 - 1995)
  • Sakata, JP (1996)

Company Filing History:


Years Active: 1984-1996

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8 patents (USPTO):Explore Patents

Title: Mitsuo Osada: Innovator in Semiconductor Technology

Introduction

Mitsuo Osada is a prominent inventor based in Hyogo, Japan, known for his significant contributions to semiconductor technology. With a total of 8 patents to his name, Osada has made remarkable advancements in the field, particularly in the design and manufacturing of heat-sink bases for semiconductor devices.

Latest Patents

One of his latest patents is the "Semiconductor element-mounting composite heat-sink base." This innovative heat-sink base is designed for use with plastic packages or flexible printed wiring boards. It effectively eliminates the risk of reliability issues arising from differences in thermal expansion coefficients between the heat sink base and the semiconductor or plastic package. The heat-sink base features a semiconductor-mounting portion made from a Cu--W or Cu--Mo composite alloy, which contains 5 to 25 wt. % of copper, produced through an infiltration process. Additionally, the portion adjacent to the plastic package is composed of copper or a copper alloy containing at least 95% copper.

Another notable patent is for "Semiconductor-mounting heat-radiative substrates, a method of making and." This patent outlines a method for manufacturing heat-radiative substrates that support semiconductor devices such as integrated circuits (ICs) and transistors. The process involves joining multiple CuW or CuMo composite materials, obtained through the infiltration method or mixed powder sintering method, with copper interposed between them. This technique ensures that the empty holes within the CuW or CuMo materials are adequately filled with copper, resulting in high-quality packages with excellent thermal characteristics.

Career Highlights

Mitsuo Osada is currently employed at Sumitomo Electric Industries, Limited, where he continues to innovate and develop cutting-edge semiconductor technologies. His work has significantly impacted the efficiency and reliability of semiconductor devices in various applications.

Collaborations

Osada has collaborated with notable colleagues, including Kenichiro Kohmoto and Nobuhito Kuroishi, contributing to advancements in semiconductor technology through teamwork and shared expertise.

Conclusion

Mitsuo Osada's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a leading inventor in the field. His work continues to influence the development of reliable and efficient semiconductor devices.

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