Saitama, Japan

Mitsuhiro Sato

This inventor holds 1 USPTO granted patent. Top assignee: Taisei Lamick Co., Ltd.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mitsuhiro Sato. Retrieved from https://idiyas.com/inventor/mitsuhiro-sato-vz8mc0cb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Mitsuhiro Sato: Innovator in Heat-Sealing Technology

Introduction

Mitsuhiro Sato is a notable inventor based in Saitama, Japan. He has made significant contributions to the field of packaging technology, particularly with his innovative heat-sealing device. His work has implications for various industries that rely on efficient packaging solutions.

Latest Patents

Mitsuhiro Sato holds a patent for a heat-sealing device and filling-packing machine. This device is designed to properly adjust the pushing force applied from the heat-sealing roll to the packing film based on the feeding rate of the film. The invention includes a pushing mechanism made of two cylinders that hold the packing film, along with a fluid pressure controlling system that ensures optimal performance.

Career Highlights

Sato is currently employed at Taisei Lamick Co., Ltd., where he continues to develop innovative solutions in packaging technology. His expertise in heat-sealing devices has positioned him as a key figure in his field.

Collaborations

Mitsuhiro Sato has collaborated with Koichi Arai, contributing to advancements in their shared area of expertise. Their partnership has fostered innovation and improved the functionality of packaging systems.

Conclusion

Mitsuhiro Sato's contributions to heat-sealing technology exemplify the importance of innovation in the packaging industry. His patent and ongoing work at Taisei Lamick Co., Ltd. highlight his commitment to enhancing packaging efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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