Tokushima, Japan

Mitsuhiko Shinohara



Average Co-Inventor Count = 3.9

ph-index = 4

Forward Citations = 71(Granted Patents)


Location History:

  • Tarohachisu, JP (2003)
  • Tokushima-ken, JP (2006 - 2007)
  • Tokushima, JP (2004 - 2018)

Company Filing History:


Years Active: 2003-2018

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5 patents (USPTO):Explore Patents

Title: Mitsuhiko Shinohara: Innovator in Packaging Technology

Introduction

Mitsuhiko Shinohara is a notable inventor based in Tokushima, Japan. He has made significant contributions to the field of packaging technology, holding a total of five patents. His innovative designs focus on improving the functionality and efficiency of packaging containers.

Latest Patents

One of Shinohara's latest patents is a packaging container designed to enhance sealing and ease of opening. This container features a synthetic resin body with a flange part at the opening and a cap that is heat-sealed onto the flange. The design includes a first cutout part that allows for stable sealing and easy opening, minimizing the impact of molten resin during the sealing process. Another significant invention is an ultrasonic sealing apparatus that transversely seals packing materials. This apparatus utilizes a horn with a flat sealing face and an opposing jaw that presses the packing material, creating a molten thermoplastic resin bulge for effective sealing.

Career Highlights

Throughout his career, Mitsuhiko Shinohara has worked with reputable companies such as Shikoku Kakoki Co., Ltd. and Yakult Honsha Co., Ltd. His experience in these organizations has contributed to his expertise in packaging technology and innovation.

Collaborations

Shinohara has collaborated with notable coworkers, including Michio Ueda and Takeshi Iseki. Their combined efforts have further advanced the field of packaging technology.

Conclusion

Mitsuhiko Shinohara's contributions to packaging technology through his innovative patents and collaborations highlight his role as a significant inventor in this field. His work continues to influence the industry and improve packaging solutions.

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