Company Filing History:
Years Active: 2023-2025
Title: Minseung Ji - Innovator in Semiconductor Packaging
Introduction
Minseung Ji is an inventor based in Suwon-si, South Korea. He is recognized for his contributions to the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Minseung Ji's recent patent applications include a semiconductor package that features a first semiconductor chip, a dummy die on the first semiconductor chip, and second semiconductor chips stacked on the dummy die. This design also incorporates a dummy plate on the second semiconductor chips. Each component, including the first semiconductor chip, the dummy die, and the second semiconductor chips, includes through-electrodes. The dummy die and the second semiconductor chip closest to the dummy die are connected by direct contact of bonding pads. Additionally, adjacent second semiconductor chips are connected to each other in a similar manner. The design specifies various widths for the components in a horizontal direction, with the fourth width being greater than the second and third widths.
Another application involves a semiconductor package that includes a lower chip with bonding pads and an upper chip that is hybrid-bonded to the lower chip. The first bonding pads are shaped with equal axis lengths and are located in the center region of the chips. In contrast, the second bonding pads have differing axis lengths and are positioned near the corners of the chip. This innovative arrangement enhances the functionality and efficiency of semiconductor packaging.
Conclusion
Minseung Ji is an emerging inventor in the semiconductor industry, showcasing his innovative spirit through his latest patent applications. His work reflects a commitment to advancing technology in semiconductor packaging.