This inventor holds 1 USPTO granted patent. Top assignees: Hitachi Cable, Inc., Hitachi Computer Peripherals Co., Ltd., Hitachi, Ltd.. Active years: 1990.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
1 out of 836 
1 out of 67 
1 out of 42,740 
Years Active: 1990
Title: Minoru Taguchi: Inventor of a Wire Coating for Ultrasonic Bonding.
Introduction
Minoru Taguchi is an inventor associated with Odawara, Japan. His work includes a patented wire coating designed for ultrasonic bonding.
Latest Patents
Taguchi is credited with 1 patent, titled “Wire with Coating for Ultrasonic Bonding.” The invention concerns a wire coated with a layer for bonding to a joint body through ultrasonic vibration. The coating comprises urethane resin formulated with brominated epoxy resin.
Career Highlights
Taguchi’s listed company affiliations include Hitachi, Ltd. and Hitachi Computer Peripherals Co., Ltd. His patent reflects work on materials and wire construction for ultrasonic bonding applications.
Collaborations
Taguchi’s listed coworkers include Shigeo Hara and Setsuo Sekine.
Conclusion
Minoru Taguchi’s patent documents a specialized wire coating intended to support bonding through ultrasonic vibration, alongside his professional associations with Hitachi companies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile