Nanjing, China

Mingzhou Chen

This inventor holds 1 USPTO granted patent. Top assignee: Nanjing Chervon Industry Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mingzhou Chen. Retrieved from https://idiyas.com/inventor/mingzhou-chen-x60r8iy4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations of Mingzhou Chen

Introduction

Mingzhou Chen is a notable inventor based in Nanjing, China. He has made significant contributions to the field of cutting devices, showcasing his innovative spirit and technical expertise. His work has led to the development of a unique cutting device that enhances efficiency and functionality.

Latest Patents

Mingzhou Chen holds a patent for a cutting device that features a housing with a handle portion and an accommodation portion. The device includes a cutting portion connected to the housing, a motor that extends in a first linear direction, and a bottom plate with an opening for the cutting portion. The design incorporates a worm gear and worm structure, allowing for effective power transmission to drive the cutting chain.

Career Highlights

Mingzhou Chen is associated with Nanjing Chervon Industry Co., Ltd., where he applies his innovative ideas to develop advanced cutting technologies. His patent reflects his commitment to improving tools used in various industries, making them more efficient and user-friendly.

Collaborations

Mingzhou has collaborated with talented individuals such as Robert Doumani and Junyong Yang, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Mingzhou Chen's contributions to the field of cutting devices exemplify his dedication to innovation and improvement. His patent and collaborative efforts highlight the importance of teamwork in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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