Hangzhou, China

Mingyu Qiao

This inventor holds 1 USPTO granted patent. Top assignee: Zhejiang Sanhua Automotive Components Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mingyu Qiao. Retrieved from https://idiyas.com/inventor/mingyu-qiao-spu8zew4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mingyu Qiao and His Patent for a Connection Apparatus

Introduction

Mingyu Qiao is an inventor associated with Hangzhou, China, and Zhejiang Sanhua Automotive Components Co., Ltd. His listed patent focuses on a connection apparatus and an integrated assembly.

Latest Patents

Qiao is credited with 1 patent: “Connection Apparatus and Integrated Assembly.” The invention describes a connection apparatus with a base portion and a flow passage portion, along with multiple element connection portions and external interfaces for connecting to a system. The base has at least two accommodating portions, while the flow passage portion includes modules and a connection part. A limiting structure restricts module movement, and a notch between adjacent accommodating portions accommodates part of the connection part, which links at least one pair of neighboring modules.

Career Highlights

The available information associates Qiao’s patent work with Zhejiang Sanhua Automotive Components Co., Ltd. His listed invention addresses the arrangement and connection of components within an integrated assembly.

Collaborations

Chao Shi and Jianmin Zhang are identified as Qiao’s coworkers. The provided information does not specify their roles in the patent.

Conclusion

Mingyu Qiao’s listed patent presents a structural approach to connecting modules and interfaces in an integrated assembly, reflecting his documented innovation work in Hangzhou.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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