Mingyang Liu

Title: The Innovations of Mingyang Liu

Introduction

Mingyang Liu is a prominent inventor based in Qingdao, China. He is known for his contributions to the field of transparent conductive films. His innovative approach combines advanced printing technologies with practical applications in electronics.

Latest Patents

Mingyang Liu holds a patent for a manufacturing method of an embedded metal mesh flexible transparent conductive film. This patent describes a process that includes directly printing a metal mesh transparent electrode on a rigid substrate using electric-field-driven jet deposition micro-nano 3D printing technology. The method involves performing conductive treatment on the printed metal mesh structure through a sintering process to achieve conductivity. The process also includes heating both the flexible transparent substrate and the rigid substrate to specific temperatures, embedding the metal mesh structure into the flexible substrate through thermal imprinting, and finally separating the embedded structure from the rigid substrate. This innovative method allows for the mass production of large-size embedded metal mesh flexible transparent electrodes at low cost and high throughput.

Career Highlights

Mingyang Liu has worked at notable institutions such as Qingdao University of Technology and Qingdao 5D Intelligent Additive Manufacturing Technology Co., Ltd. His work has significantly impacted the development of flexible electronics and conductive materials.

Collaborations

Mingyang Liu has collaborated with esteemed colleagues, including Hongbo Lan and Xiaoyang Zhu. Their joint efforts have contributed to advancements in additive manufacturing and innovative material applications.

Conclusion

Mingyang Liu's contributions to the field of transparent conductive films exemplify the intersection of innovation and practical application. His work continues to influence the development of advanced materials in electronics.