Santa Rosa, CA, United States of America

Mingwei Li

This inventor holds 1 USPTO granted patent. Top assignee: The Penn State Research Foundation. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mingwei Li. Retrieved from https://idiyas.com/inventor/mingwei-li-95r5nh8e

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Mingwei Li

Introduction

Mingwei Li is a notable inventor based in Santa Rosa, CA (US). He has made significant contributions to the field of nanotechnology and electronic devices. His innovative work focuses on the assembly of structures on substrates, which has implications for various technological applications.

Latest Patents

Mingwei Li holds 1 patent for his invention titled "Bottom-up assembly of structures on a substrate." This patent describes methods for assembling structures, such as nanostructures, at predetermined locations on a substrate. The invention utilizes a voltage between spaced-apart electrodes to attract structures to the substrate, allowing for precise positional registration using topographic features like wells. Additionally, the methods can be applied to create electronic and optoelectronic devices.

Career Highlights

Mingwei Li is associated with the Penn State Research Foundation, where he continues to advance his research and development efforts. His work has garnered attention for its potential to revolutionize the way structures are assembled at the nanoscale.

Collaborations

Mingwei has collaborated with esteemed colleagues, including Thomas Morrow and Jaekyun Kim. Their combined expertise contributes to the innovative projects undertaken at the Penn State Research Foundation.

Conclusion

Mingwei Li's contributions to the field of nanotechnology and electronic devices highlight his role as a leading inventor. His patent on the bottom-up assembly of structures showcases the potential for advancements in technology through innovative methods.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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