Company Filing History:
Years Active: 2017
Title: The Innovative Contributions of Minghui Gao
Introduction
Minghui Gao is a prominent inventor based in Hong Kong, China. He has made significant contributions to the field of electroplating through his innovative patents. With a total of 2 patents, Gao's work focuses on improving the efficiency and effectiveness of electroplating processes.
Latest Patents
Gao's latest patents include an "Apparatus and method for fast evaluation of electroplating formulation performance in microvia filling." This invention provides an electrochemical analytical apparatus and a method for evaluating the performance of electroplating formulations used for via filling. The apparatus comprises an electric power generating device, an electrical output signal measurement device, an electrochemical measurement device, and a motion generator. The method allows for accurate and cost-effective evaluation of electroplating formulations, enabling the selection of the best formulation for microvia filling processes.
Another notable patent is the "Method of analyzing at least two inhibitors simultaneously in a plating bath." This invention offers a fast and cost-effective method for determining the additive concentrations of multiple inhibitors in an electroplating bath. By using different electrical load conditions, the method effectively maintains additive concentrations within predefined limits during device production.
Career Highlights
Minghui Gao is associated with the Hong Kong Applied Science and Technology Research Institute Company Limited. His work at this institution has allowed him to focus on advancing electroplating technologies and contributing to the field of materials science.
Collaborations
Gao has collaborated with notable coworkers, including Yaofeng Sun and Shu Kin Yau. Their combined efforts have furthered research and development in electroplating technologies.
Conclusion
Minghui Gao's innovative patents and contributions to electroplating demonstrate his commitment to advancing technology in this field. His work not only enhances the efficiency of electroplating processes but also sets a foundation for future innovations.