West Bloomfield, MI, United States of America

MingFeng Shi

This inventor holds 1 USPTO granted patent and 9 published patent applications. Top assignee: Gm Global Technolgoy Operations, Inc.. Active years: 2023.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by MingFeng Shi

Introduction

MingFeng Shi is an accomplished inventor based in West Bloomfield, MI (US). He has made significant contributions to the field of manufacturing, particularly in the area of resistance spot welding. His innovative approach aims to enhance joint strength while minimizing embrittlement in metal workpieces.

Latest Patents

MingFeng Shi holds 1 patent for his invention titled "System and method of manufacturing a resistance spot weld of workpieces." This patent describes a system designed to improve the quality of weld joints between metal workpieces. The system includes a stackup of first and second metal workpieces, with an interface member that enhances the welding process. The design features a peripheral wall that defines a hollow inner portion, allowing for effective heat application through electrodes to create strong welds.

Career Highlights

MingFeng Shi is currently employed at GM Global Technology Operations LLC, where he continues to innovate and develop advanced manufacturing techniques. His work focuses on improving welding processes, which are critical in various manufacturing applications.

Collaborations

MingFeng has collaborated with notable coworkers such as Huaxin Li and Jatinder P Singh. Their combined expertise contributes to the advancement of technologies in the manufacturing sector.

Conclusion

MingFeng Shi's contributions to resistance spot welding technology exemplify the importance of innovation in manufacturing. His patent reflects a commitment to enhancing the strength and reliability of weld joints, showcasing his role as a key inventor in this field.

Profile summary based on public USPTO records.
Please report any incorrect information to [email protected]
Loading…