Company Filing History:
Years Active: 2023
Title: The Innovations of Mingchuan Han
Introduction
Mingchuan Han is a notable inventor based in Tianjin, China. He has made significant contributions to the field of integrated circuit packaging. His innovative approach aims to enhance the reliability and efficiency of electronic devices.
Latest Patents
Mingchuan Han holds a patent for an integrated circuit package and a method to manufacture the integrated circuit package to reduce bond wire defects. This patent describes a process where an integrated circuit die is positioned on a die pad of a leadframe. It involves connecting a bond wire between the die and a bond pad of the leadframe, followed by encapsulating these components with an encapsulant material to form a first mold cap. After encapsulation, the method includes bending one or more leads of the leadframe to create bent leads, which are then encapsulated with the encapsulant material to form a second mold cap. This innovative design aims to improve the overall performance and reliability of integrated circuits.
Career Highlights
Mingchuan Han is currently employed at NXP USA, Inc., where he continues to develop cutting-edge technologies in the field of electronics. His work focuses on enhancing the manufacturing processes of integrated circuits, contributing to advancements in the industry.
Collaborations
Mingchuan has collaborated with notable colleagues such as Jian Song and Jun Li. Their combined expertise has fostered a productive environment for innovation and development in integrated circuit technology.
Conclusion
Mingchuan Han's contributions to integrated circuit packaging demonstrate his commitment to innovation and excellence in the field. His patent reflects a significant advancement that addresses common challenges in the industry.