Company Filing History:
Years Active: 2003
Title: Innovations of Ming-Xun Lee
Introduction
Ming-Xun Lee is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of electronics, particularly in the development of advanced packaging technologies. With a total of 2 patents to his name, Lee continues to push the boundaries of innovation in his industry.
Latest Patents
Ming-Xun Lee's latest patents include a method of fabricating a CDBGA package. This innovative package comprises a thermal dissipating substrate and a plurality of conductive bumps. A plurality of vias are formed on a circuit substrate and correspond to the conductive bumps. Additionally, a plurality of ground pads, ball pads, and nodes are formed on the circuit substrate, with the ground pads located in the vias. A solder mask layer covers the patterned trace layer, while a plurality of bonding pads are formed on a chip and are electrically connected to the nodes. A molding compound encapsulates the chip, nodes, and bonding pads. Furthermore, a plurality of solder balls are located on the ground pads and ball pads, filling the vias and electrically connecting to the conductive bumps.
Career Highlights
Ming-Xun Lee is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work focuses on enhancing the efficiency and reliability of electronic components through innovative packaging solutions.
Collaborations
Lee collaborates with talented professionals in his field, including his coworker Chin-Te Chen. Their combined expertise contributes to the advancement of technology in their projects.
Conclusion
Ming-Xun Lee's contributions to the field of electronics through his patents and work at Siliconware Precision Industries Co., Ltd. highlight his role as an influential inventor. His innovative approaches continue to shape the future of electronic packaging technologies.