Hsinchu, Taiwan

Ming Tsai Chung

This inventor holds 3 USPTO granted patents. Top assignee: D-Link Corporation. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Tsai Chung. Retrieved from https://idiyas.com/inventor/ming-tsai-chung-vxlia9jh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 66.7

Average Co-Inventor Count = 1.2

ph-index = 3

Forward Citations = 96(Granted Patents)


Company Filing History:


Years Active: 2005

Loading Chart...
3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Ming Tsai Chung

Introduction: Ming Tsai Chung, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Ming Tsai Chung's latest patents focus on advancements in semiconductor technology, particularly in the development of nanoscale electronic devices with enhanced performance and efficiency.

Career Highlights: With a career spanning over two decades, Ming Tsai Chung has established himself as a leading figure in the field of microelectronics. His work has been instrumental in shaping the future of the industry, with a strong emphasis on innovation and cutting-edge research.

Collaborations: Throughout his career, Ming Tsai Chung has collaborated with top research institutions, leading companies, and esteemed universities to further his research and bring his inventions to life. His collaborative efforts have resulted in groundbreaking technologies that have revolutionized the semiconductor industry.

Conclusion: Ming Tsai Chung's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor. His contributions continue to inspire future generations of inventors and pave the way for new advancements in the field of microelectronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…