Wujiang, China

Ming-Quan Cui

This inventor holds 3 USPTO granted patents and 4 published patent applications. Top assignee: Tai-Sol Electronics Co., Ltd.. Active years: 2019-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Quan Cui. Retrieved from https://idiyas.com/inventor/ming-quan-cui

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 33.3

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 4(Granted Patents)


Location History:

  • Wujiang, CN (2020)
  • Wujiang, TW (2019 - 2021)

Company Filing History:


Years Active: 2019-2021

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3 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Inventor Ming-Quan Cui**

Introduction

Ming-Quan Cui is a notable inventor based in Wujiang, China, with a remarkable portfolio of three patents. His work primarily focuses on thermal management technologies, contributing to advancements in cooling systems used in various applications.

Latest Patents

Cui’s latest patent showcases a sophisticated vapor chamber design. This vapor chamber utilizes a capillary structure coupled with bumps to create an efficient liquid-vapor channel. The design consists of a first panel that delineates an evaporation region, a thermal insulation region, and a condensation region. A second panel is joined to the first panel, thereby defining an enclosed accommodation space between them. Inside this accommodation, a capillary material and a working fluid are strategically placed. Noteworthy features include a multitude of first bumps within the evaporation, thermal insulation, and condensation regions that directly abut the capillary material. Additionally, the capillary material incorporates a hollow section in the thermal insulation region, which exposes parts of the first bumps for enhanced thermal interaction. The second panel houses various second bumps that are aligned against the first bumps within the hollow section, optimizing the thermal efficiency of the device.

Career Highlights

Ming-Quan Cui has made significant strides in the field of electronics through his role at Tai-Sol Electronics Co., Ltd. His inventive spirit and dedication to developing innovative solutions have been pivotal to his company's advancements.

Collaborations

Cui has collaborated closely with talented colleagues, including Chuan-Chi Tseng and Wen-Ching Liao. Together, they contribute to the development of cutting-edge technologies that push the boundaries of thermal management systems.

Conclusion

Ming-Quan Cui exemplifies the spirit of innovation through his inventive work in thermal technology. With a growing portfolio of patents and valuable collaborations, Cui continues to pave the way for advancements that benefit various industries. His contributions are a testament to the importance of creative thinking in tackling modern engineering challenges.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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