Hsinchu, Taiwan

Ming-Liang Hsieh

This inventor holds 2 USPTO granted patents. Top assignee: Industrial Technology Research Institute. Active years: 2000.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Liang Hsieh. Retrieved from https://idiyas.com/inventor/ming-liang-hsieh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2000

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations of Ming-Liang Hsieh

Introduction

Ming-Liang Hsieh is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced apparatuses for chip handling and soldering operations. With a total of 2 patents, his work reflects a commitment to enhancing efficiency and precision in industrial applications.

Latest Patents

Hsieh's latest patents include a chip supplying apparatus that performs a stable blue-film-expansion operation. This innovative device is designed to pick chips from a wafer positioned on an elastic film. The apparatus features a shifting device, a clutch device, a film-expanding device, and a chip-picking device. Notably, the input torque provided by the clutching device is orthogonal to the resulting rotation torque of the film-expanding device. This design ensures that the film-expanding operation is stable and free from shaking.

Another significant patent is the solder head control mechanism. This mechanism utilizes a small-sized, simply structured acoustic coil linear servomotor to directly drive a solder head for soldering operations. The solder head is linked with a position sensor, a controller, and a current output actuator, forming a closed-loop control mechanism. This design allows for small inertia, fast response time, and great positioning accuracy, with the controller dynamically adjusting the amplifying value to actuate the solder head effectively.

Career Highlights

Ming-Liang Hsieh is associated with the Industrial Technology Research Institute, where he has been instrumental in advancing research and development in his field. His innovative approaches have contributed to the institute's reputation for fostering technological advancements.

Collaborations

Hsieh has collaborated with notable colleagues, including Tun-Chih Shih and Wen-Jung Lu. Their combined expertise has further enhanced the quality and impact of their research projects.

Conclusion

Ming-Liang Hsieh's contributions to technology through his patents demonstrate his innovative spirit and dedication to improving industrial processes. His work continues to influence the field, showcasing the importance of invention in driving technological progress.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…