Company Filing History:
2 out of 1,231 
2 out of 778 
2 out of 19,772 
Years Active: 2005-2009
Title: **Innovator Spotlight: Ming-Kun Cao**
Introduction
Ming-Kun Cao, an accomplished inventor based in Shenzhen, China, has made significant contributions to the field of heat dissipation technology. With a total of four patents to his name, his innovative designs showcase the blend of functionality and efficiency necessary for modern electronic devices.
Latest Patents
One of Ming-Kun Cao's most recent patents is a "Fan bracket and heat dissipation apparatus incorporating the same." This invention comprises a heat dissipation apparatus consisting of a fan bracket, fan, and heat sink. The fan bracket features a housing, a support portion extending from the housing, and multiple arm portions that extend in an opposite direction from the support portion. Each arm portion has engaging portions that connect with fasteners to secure the heat dissipation apparatus onto a printed circuit board. Notably, two of the arm portions are designed with hooks that help to hold the heat sink in place, enhancing the overall efficiency of the thermal management system.
Career Highlights
Throughout his career, Ming-Kun Cao has collaborated with reputable companies in the technology sector. He has been associated with Fu Zhun Precision Industry Co., Ltd. and Hon Hai Precision Industry Co., Ltd., where he has applied his skills to further innovations in electronic manufacturing and design.
Collaborations
Ming-Kun has worked closely with talented colleagues such as Fang-Xiang Yu and Meng-Tzu Lee, fostering an environment of collaboration that emphasizes creativity and technical expertise. Together, they have contributed to advancements in the functionalities of electronic components, particularly in relation to heat management solutions.
Conclusion
Ming-Kun Cao stands out as a notable figure in the realm of innovations focused on heat dissipation technologies. His latest patent work reflects a deep understanding of the demands placed on electronic devices today. As he continues to develop new solutions, the impact of his contributions is likely to resonate throughout the field of electronics and beyond.