Ming Koon Ang

Title: The Innovative Contributions of Ming Koon Ang

Introduction

Ming Koon Ang is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor technology. He has developed a method for forming reliable semiconductor packages, which has significant implications for the electronics industry. His innovative approach enhances the durability and performance of semiconductor devices.

Latest Patents

Ming Koon Ang holds a patent for a method of forming a semiconductor package. This method involves providing a package substrate with specific features, including a die attach region. A die is attached to this region, and a protective cover is applied to safeguard the die active region. The patent emphasizes the importance of adhesion and encapsulation, ensuring that the semiconductor package is both reliable and efficient. He has 1 patent to his name.

Career Highlights

Ming Koon Ang is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in the semiconductor field. His work has contributed to advancements in packaging technology, which is crucial for the performance of electronic devices. His expertise in this area has made him a valuable asset to his company.

Collaborations

Ming Koon Ang has collaborated with notable colleagues, including Hua Hong Tan and Chee Kay Chow. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas within the semiconductor industry.

Conclusion

Ming Koon Ang's contributions to semiconductor technology through his patent and work at Utac Headquarters Pte. Ltd. highlight his role as an influential inventor in the field. His innovative methods are paving the way for advancements in electronic device reliability and performance.