Company Filing History:
Years Active: 2006
Title: Innovations of Ming-Jiun Lai in Substrate Technology
Introduction
Ming-Jiun Lai is a notable inventor based in Changhua County, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the prevention of electrostatic discharge (ESD) damage during packaging processes. His innovative approach has led to the development of a unique method and structure that enhances the reliability of substrate strips.
Latest Patents
Ming-Jiun Lai holds a patent for a "Method and structure for prevention leakage of substrate strip." This invention provides a comprehensive solution to prevent leakage in substrate strips, which are critical components in electronic devices. The substrate strip features an edge portion and multiple units, with a patterned metal layer that includes plating buses, contact pads, and fiducial marks. The design ensures that the extended trail of the plating bus is electrically isolated from the contact pads, thereby protecting chips from ESD during packaging.
Career Highlights
Ming-Jiun Lai is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor technologies. His work has been instrumental in improving the performance and durability of electronic components. With a focus on practical solutions, he has successfully translated his ideas into patented technologies that benefit the industry.
Collaborations
Ming-Jiun Lai has collaborated with talented colleagues such as Ying-Chih Chen and Yun-Hsiang Tien. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Ming-Jiun Lai's contributions to substrate technology exemplify the importance of innovation in the semiconductor industry. His patented methods not only enhance the reliability of electronic devices but also pave the way for future advancements in the field.