Company Filing History:
Years Active: 2013-2015
Title: Innovations by Ming-Huang Ting
Introduction
Ming-Huang Ting is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of embedded package structures, holding a total of 2 patents. His work is characterized by innovative methods that enhance the efficiency and functionality of electronic components.
Latest Patents
Ming-Huang Ting's latest patents focus on a fabricating method of embedded package structures. The first patent describes a process that involves combining first and second boards to create an integrated panel. Circuit structures are formed on these boards, and an embedded element is electrically disposed on the first circuit structure. Conductive bumps are formed on both the conductive circuit substrate and the second circuit structure. The method includes a laminating process that encapsulates the embedded element with semi-cured films, ensuring electrical connections are established through the conductive bumps. The second patent reiterates this innovative approach, emphasizing the efficiency of the laminating process and the electrical connections achieved.
Career Highlights
Ming-Huang Ting is currently employed at Unimicron Technology Corporation, where he continues to develop cutting-edge technologies in the field of electronics. His expertise in embedded package structures has positioned him as a key player in the industry, contributing to advancements that benefit various applications.
Collaborations
Ming-Huang Ting collaborates with Tsung-Yuan Chen, working together to push the boundaries of innovation in their field. Their partnership exemplifies the importance of teamwork in achieving groundbreaking results.
Conclusion
Ming-Huang Ting's contributions to the field of embedded package structures demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic design and fabrication methods, making him a valuable asset to Unimicron Technology Corporation and the broader technology community.