Company Filing History:
Years Active: 2013-2017
Title: The Innovations of Ming-Hsiu Chung
Introduction
Ming-Hsiu Chung is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of technology, particularly in the areas of cooling systems and heat dissipation. With a total of 7 patents to his name, Chung continues to push the boundaries of innovation.
Latest Patents
Chung's latest patents include a "Magnet case and rotor incorporating the same." This invention features a magnet case designed for a rotor, which includes a hollow cylindrical supporting body that accommodates two magnetic bands. The design incorporates an annular flange extending outwardly from the top end of the supporting body, along with a positioning plate that extends inwardly from the bottom end. The annular flange has two spaced notches defined in its outer periphery, which are specifically configured to reduce vibration in a cooling fan associated with the rotor during operation. Another notable patent is the "Heat dissipating assembly and mold having the same." This assembly includes an angular pin, a heat pipe, and a liquid passage that runs through the angular pin. The design allows for efficient heat dissipation, enhancing the performance of molds in various applications.
Career Highlights
Ming-Hsiu Chung is currently employed at Foxconn Technology Co., Ltd., a leading technology company known for its manufacturing capabilities. His work at Foxconn has allowed him to collaborate on various innovative projects, further establishing his reputation as a skilled inventor.
Collaborations
Chung has worked alongside talented colleagues, including Yu-Ching Lin and Wen-Cheng Chen. Their collaborative efforts have contributed to the successful development of several innovative technologies.
Conclusion
Ming-Hsiu Chung's contributions to technology through his patents and collaborative work highlight his role as a key innovator in the industry. His inventions continue to pave the way for advancements in cooling systems and heat dissipation technologies.