Company Filing History:
1 out of 66 
1 out of 191 Years Active: 2022-2023
Title: The Innovations of Ming Hsien Ko
Introduction
Ming Hsien Ko is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of electronic components.
Latest Patents
Ming Hsien Ko's latest patents include a cover plate used in electronic devices and a force sensing module. The cover plate features a glass layer and at least one transparent covering layer, designed to improve durability and performance. The glass layer has a Young's modulus ranging from about 10 GPa to about 200 GPa. His second patent, the force sensing module, incorporates a light-transmitting force-sensitive composite layer, which includes transparent electrodes and functional spacer layers. This module boasts an optical transmittance greater than 85% and a haze of less than 3%, making it highly effective for various applications.
Career Highlights
Throughout his career, Ming Hsien Ko has worked with prominent companies such as TPK Advanced Solutions Inc. and TPK Touch Solutions (Xiamen) Inc. His experience in these organizations has allowed him to develop innovative solutions that address the needs of modern electronic devices.
Collaborations
Ming Hsien Ko has collaborated with talented individuals in his field, including Chun Yan Wu and Lien-Hsin Lee. These partnerships have contributed to the advancement of his projects and the successful development of his patents.
Conclusion
Ming Hsien Ko's contributions to the field of electronic devices through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.