Ming-Hsien Cheng

Title: Innovations by Ming-Hsien Cheng in Semiconductor Technology

Introduction

Ming-Hsien Cheng is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative approach to enhancing semiconductor packages.

Latest Patents

Cheng's latest patents include a semiconductor package having a waveguide antenna and a manufacturing method thereof. This invention features a substrate that includes a chip, an encapsulant that encapsulates both the grounding layer and the chip, and a shielding layer formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer, collectively forming a waveguide antenna. Another patent by Cheng is a semiconductor package that includes an antenna layer and a manufacturing method. This package consists of a substrate, a semiconductor chip, a package body, and an antenna layer. The antenna layer is formed on the upper surface of the package body and includes two antenna slot groups that are interconnected.

Career Highlights

Ming-Hsien Cheng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor packaging. His work has significantly impacted the efficiency and functionality of semiconductor devices.

Collaborations

Cheng has collaborated with notable colleagues such as Han-Chee Yen and Shih-Yuan Chen, contributing to advancements in semiconductor technology through teamwork and shared expertise.

Conclusion

Ming-Hsien Cheng's contributions to semiconductor technology through his patents reflect his innovative spirit and dedication to advancing the field. His work continues to influence the development of more efficient semiconductor packages.