New Taipei City, Taiwan

Ming-Hao Hsieh

This inventor holds 1 USPTO granted patent. Top assignee: Dell Products Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming-Hao Hsieh. Retrieved from https://idiyas.com/inventor/ming-hao-hsieh-os63dwx3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Ming-Hao Hsieh and a Lift-Up Foot Mechanism for Hideaway Cooling Fins.

Introduction

Ming-Hao Hsieh is an inventor associated with New Taipei City, Taiwan, and Dell Products Inc. His work includes an invention for an information handling system that coordinates a device’s foot mechanism with its cooling fins.

Latest Patents

Hsieh is credited with 1 patent, titled “Lift-up foot mechanism for hideaway cooling fins.” The invention describes a system with a top portion that opens and closes, a heatsink with an extension beyond the base, and a foot that moves between retracted and extended positions. When the top is closed, the foot retracts around the heatsink extension. When the top opens, the foot extends, making the heatsink extension visible.

Career Highlights

Hsieh’s listed patent connects mechanical movement with thermal-management design in an information handling system. The mechanism’s configuration changes with the position of the system’s top portion.

Collaborations

Hsieh is associated with Dell Products Inc. and is listed alongside fellow inventor Hao-Chieh Tseng on the patent.

Conclusion

Ming-Hao Hsieh’s patent presents a coordinated foot-and-heatsink mechanism designed to adapt as an information handling system opens and closes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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