Ming-Hane Lin

Title: Celebrating the Innovations of Inventor Ming-Hane Lin

Introduction: Ming-Hane Lin is an accomplished inventor based in Chu-Pei, Taiwan, recognized for his significant contributions to the field of electronic packaging. With one patent to his name, Lin has demonstrated a commitment to enhancing the functionality and efficiency of integrated circuit (IC) assemblies.

Latest Patents: Ming-Hane Lin's notable patent revolves around a packaging assembly with consolidated common voltage connections. This innovative design features an integrated circuit dice mounted on a substrate carrier, where the IC dice is linked to multiple bonding pads through bonding wires. This configuration improves the wire bonding layout by centralizing the common voltage pads. As a result, the electrical connections to external interface points, such as the ball grid array (BGA), are shortened. Furthermore, the design allows for a broader access window for wire bonding to the IC dice, enhancing the overall assembly process.

Career Highlights: Lin works at the Industrial Technology Research Institute, where he continues to drive innovation in electronic device packaging. His work reflects a fusion of practical application and advanced technology, providing solutions that benefit the industry.

Collaborations: Among Ming-Hane Lin’s colleagues are Chien-Chi Chao and Ted C Ho, who contribute to his projects and collaborate on various research initiatives. Together, they foster an environment of innovation and teamwork within their institute.

Conclusion: Ming-Hane Lin stands out as a talented inventor, demonstrating how dedicated individuals can significantly impact technology through their inventions. His patented designs not only showcase his technical expertise but also contribute to advancements in electronic packaging, making him a key figure in the realm of innovation in Taiwan.