Ming De Wang

Title: Innovations by Inventor Ming De Wang

Introduction

Ming De Wang is a notable inventor based in Naugatuck, CT (US). He has made significant contributions to the field of materials science, particularly in the development of compositions and methods that enhance the performance of copper surfaces in electronic applications. With a total of three patents to his name, Wang's work is pivotal in advancing technology in printed circuit board production.

Latest Patents

Wang's latest patents include an "Acid-resistance promoting composition" and a "Nano-oxide process for bonding copper/copper alloy and resin." The acid-resistance promoting composition is designed to provide acid resistance to copper surfaces used in multilayered printed circuit boards. This innovative composition consists of an acid, an oxidizer, a five-membered heterocyclic compound, and a thiophosphate or phosphorous sulfide compound, with phosphorus pentasulfide being a preferred embodiment. The application of this composition to a copper or copper alloy substrate allows for effective bonding with polymeric materials.

The nano-oxide process enhances adhesion between copper or copper alloy layers and polymeric resins. This method involves several steps, including applying a pre-dip composition, a nano-oxide composition, and a post-dip composition to the treated copper layer. The nano-oxide composition contains a chlorite, a caustic, a phosphate salt, an organic nitro compound, and a thio compound. The post-dip composition is an alkaline solution that includes a phosphate salt, a source of molybdenum ions, and a thiazole. This innovative process is particularly useful for improving the bond between copper and various types of resins.

Career Highlights

Throughout his career, Ming De Wang has demonstrated a commitment to innovation and excellence in his field. His patents reflect a deep understanding of material properties and their applications in technology. Wang's work has contributed to advancements in the manufacturing processes of electronic components, making them more efficient and reliable.

Collaborations

Wang has collaborated with several professionals in his field, including Kesheng Feng and Steven A Castaldi. These collaborations have likely enriched his research and development efforts, leading to the successful creation of his patented technologies.

Conclusion

Ming De Wang is a distinguished inventor whose work in developing advanced compositions and bonding processes for copper surfaces has made a significant impact in the