Ming-da Cheng

Title: The Innovative Contributions of Ming-da Cheng

Introduction

Ming-da Cheng is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, showcasing his expertise through his innovative patent.

Latest Patents

Ming-da Cheng holds a patent titled "Method of manufacturing semiconductor structure." This patent describes a method that includes receiving a die with a top surface and a sacrificial layer covering it. The process involves disposing of a molding around the die, removing the sacrificial layer, and applying a polymer over both the die and the molding. The polymer's first bottom surface contacts the die, while the second bottom surface contacts the molding, ensuring that both surfaces are at a substantially equal level. This innovative approach enhances the efficiency of semiconductor manufacturing.

Career Highlights

Ming-da Cheng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading entity in the semiconductor industry. His work has contributed to advancements in manufacturing techniques, solidifying his reputation as a skilled inventor.

Collaborations

Ming-da Cheng has collaborated with notable colleagues, including Yu-Hsiang Hu and Wei-Yu Chen. Their combined efforts in the semiconductor field have led to significant innovations and improvements in manufacturing processes.

Conclusion

Ming-da Cheng's contributions to semiconductor manufacturing through his patent and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor technology.