Tucheng, Taiwan

Ming Chung Lai

This inventor holds 3 USPTO granted patents. Top assignee: Cheng Uei Precision Industry Co., Ltd.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ming Chung Lai. Retrieved from https://idiyas.com/inventor/ming-chung-lai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Company Filing History:


Years Active: 2007

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3 patents (USPTO):Explore Patents

Title: The Innovations of Ming Chung Lai

Introduction

Ming Chung Lai is a notable inventor based in Tu-Cheng, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in connector technology. With a total of 3 patents to his name, Lai continues to push the boundaries of innovation.

Latest Patents

Among his latest patents are the Receptacle Connector and the Plug Connector. These inventions showcase his expertise in creating reliable and efficient electrical connections, which are essential in various electronic devices.

Career Highlights

Ming Chung Lai is currently employed at Cheng Uei Precision Industry Co., Ltd. This company is known for its commitment to quality and innovation in the manufacturing of electronic components. Lai's work at Cheng Uei has allowed him to develop and refine his inventions, contributing to the company's reputation in the industry.

Collaborations

Lai has collaborated with talented coworkers, including Mao Jung Huang and Li Jun Xu. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Ming Chung Lai's contributions to the field of electrical engineering through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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