Taoyuan, Taiwan

Ming-Chung Chung


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Zhongli, TW (2015)
  • Taoyuan, TW (2022 - 2023)

Company Filing History:


Years Active: 2015-2023

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3 patents (USPTO):

Title: Innovations of Ming-Chung Chung

Introduction

Ming-Chung Chung is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of antenna devices and chip packaging, holding a total of 3 patents. His work reflects a commitment to advancing technology in these areas.

Latest Patents

Ming-Chung Chung's latest patents include an innovative antenna device and a manufacturing method thereof. This antenna device comprises a first substrate, a second substrate, an antenna layer, and a redistribution layer. The design features an inclined sidewall that enhances its functionality. Another significant patent is for a chip package, which includes a semiconductor substrate, a supporting element, an antenna layer, and a redistribution layer. This design also incorporates an inclined sidewall and a conductive pad, showcasing his expertise in semiconductor technology.

Career Highlights

Ming-Chung Chung is currently employed at Xintec Corporation, where he continues to develop cutting-edge technologies. His work at Xintec has positioned him as a key player in the field of semiconductor and antenna innovations.

Collaborations

Ming-Chung Chung collaborates with talented individuals such as Jiun-Yen Lai and Wei-Luen Suen. Their teamwork fosters an environment of creativity and innovation, contributing to the success of their projects.

Conclusion

Ming-Chung Chung's contributions to antenna devices and chip packaging demonstrate his innovative spirit and technical expertise. His patents reflect a deep understanding of technology and a commitment to advancing the field.

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