Company Filing History:
Years Active: 2004-2006
Title: Innovations by Inventor Ming-Chun Laio
Introduction
Ming-Chun Laio is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving the efficiency and reliability of semiconductor packages.
Latest Patents
Ming-Chun Laio's latest patents include a wire-bonding method and a semiconductor package utilizing this method. The wire-bonding method features a semiconductor package that includes a carrier and a chip mounted on it. This design incorporates a plurality of first and second wires arranged in a staggered manner, with the second wires having downwardly bent loops. This unique configuration increases the pitch between adjacent wires, preventing contact and short circuits during the encapsulation process.
Another significant patent is a semiconductor package with a heat dissipating structure. This package includes a lead frame with a die pad for chip mounting and a heat sink that abuts the die pad. The heat sink is designed with a recessed portion that allows resin material to fill during the molding process, forming a supporting member. This innovation helps prevent chip cracking during the packing pressure build-up, ensuring higher yield and reliability of the final products.
Career Highlights
Ming-Chun Laio is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing semiconductor packaging technologies. His innovative approaches have contributed to the development of more reliable and efficient semiconductor products.
Collaborations
Ming-Chun Laio has collaborated with notable coworkers, including Fu-Di Tang and Cha-Yun Yin. Their combined expertise has fostered a productive environment for innovation and development in semiconductor technologies.
Conclusion
Ming-Chun Laio's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His work continues to influence the reliability and efficiency of semiconductor packages, showcasing the importance of innovation in technology.