This inventor holds 1 USPTO granted patent. Top assignee: Unimicron Technology Corporation. Active years: 2019.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2019
Title: Innovations of Ming-Chia Li in Circuit Structure Manufacturing
Introduction
Ming-Chia Li is a notable inventor based in Taoyuan County, Taiwan. He has made significant contributions to the field of circuit structure manufacturing, particularly with his innovative methods that enhance heat dissipation in electronic devices. His work is crucial in improving the performance and reliability of electronic components.
Latest Patents
Ming-Chia Li holds a patent for a manufacturing method of a circuit structure embedded with a heat-dissipation block. This patent outlines a detailed process that includes providing a core board with a first dielectric layer and two conductive layers. A through hole is formed in the core board, into which a heat-dissipation block is disposed. The method also involves forming inner-layer circuits and bonding a build-up structure that includes additional dielectric and conductive layers. This innovative approach addresses the critical need for effective heat management in electronic devices.
Career Highlights
Ming-Chia Li is associated with Unimicron Technology Corporation, a leading company in the electronics manufacturing sector. His work at Unimicron has allowed him to focus on developing advanced manufacturing techniques that contribute to the efficiency and performance of electronic products. His expertise in circuit design and manufacturing processes has positioned him as a valuable asset in the industry.
Collaborations
Ming-Chia Li collaborates with his coworker, Cheng-Po Yu, to further enhance their research and development efforts. Together, they work on innovative solutions that push the boundaries of current technology in circuit manufacturing.
Conclusion
Ming-Chia Li's contributions to the field of circuit structure manufacturing are significant and impactful. His innovative patent for a manufacturing method embedded with a heat-dissipation block showcases his commitment to advancing technology in electronics. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile