This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: The Innovative Contributions of Ming Cheng
Introduction
Ming Cheng is a notable inventor based in Dongguan, China. He has made significant contributions to the field of heat conduction technology. His work focuses on enhancing the efficiency and durability of heat conducting members used in various applications.
Latest Patents
Ming Cheng holds a patent for a "Heat conducting member, optical module, heat sink, and method for preparing heat conducting member." This innovative patent describes a heat conducting member that includes a substrate and a heat conducting layer. The substrate features a heat conducting surface, while the heat conducting layer consists of a transition layer and a protective layer. The transition layer is strategically placed on the heat conducting surface, and the protective layer is positioned on the surface of the transition layer that is away from the heat conducting surface. Notably, the roughness Ra of the protective layer is less than or equal to 0.4. This design allows the transition layer to provide a hardness transition function between the substrate and the protective layer, ultimately improving the overall hardness of the heat conducting member. The protective layer also ensures surface hardness, preventing issues such as scratches.
Career Highlights
Ming Cheng is currently employed at Huawei Technologies Co., Ltd., a leading global provider of information and communications technology (ICT) infrastructure and smart devices. His role at Huawei has allowed him to work on cutting-edge technologies and contribute to the company's innovative projects.
Collaborations
Ming Cheng has collaborated with talented coworkers, including Buping Yuan and Chengpeng Yang. Their combined expertise has fostered a productive environment for innovation and development within their projects.
Conclusion
Ming Cheng's contributions to heat conduction technology exemplify the importance of innovation in enhancing product performance and durability. His patent and work at Huawei Technologies Co., Ltd. highlight his commitment to advancing technology in meaningful ways.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile