Company Filing History:
Years Active: 2013-2015
Title: Innovations by Ming Chen Sun in Semiconductor Packaging
Introduction
Ming Chen Sun is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on improving the fabrication methods of semiconductor packages, which are crucial for the miniaturization and efficiency of electronic devices.
Latest Patents
Ming Chen Sun's latest patents include a novel fabrication method of a semiconductor package. This method involves several steps: forming a packaging substrate on a first carrier, bonding a second carrier to the packaging substrate, removing the first carrier, disposing a chip on the packaging substrate, forming an encapsulant on the packaging substrate to encapsulate the chip, and finally removing the second carrier. The innovative use of the first and second carriers provides the thin-type packaging substrate with sufficient rigidity to withstand fabrication processes without cracking or warpage. This advancement meets the miniaturization requirements and significantly improves product yield.
Another patent by Ming Chen Sun is also centered around the fabrication method of a semiconductor package, reiterating the importance of the steps mentioned above. The focus remains on ensuring that the packaging substrate maintains its integrity during the fabrication process, which is essential for modern electronic applications.
Career Highlights
Ming Chen Sun is currently employed at Siliconware Precision Industries Co., Ltd. His role in the company allows him to apply his innovative ideas and contribute to the advancement of semiconductor technology. His expertise in the field has positioned him as a key player in the development of efficient packaging solutions.
Collaborations
Ming Chen Sun collaborates with talented coworkers such as Chun Hsien Lin and Yu Cheng Pai. Their combined efforts in research and development have led to significant advancements in semiconductor packaging technologies.
Conclusion
Ming Chen Sun's contributions to semiconductor packaging through his innovative patents highlight his expertise and commitment to advancing technology in this field. His work not only enhances product yield but also supports the ongoing trend of miniaturization in electronics.