Yongin-si, South Korea

Min-hyo Park


Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 17(Granted Patents)


Location History:

  • Gyeonggi-do, KR (2011)
  • Yongin-si, KR (2010 - 2012)

Company Filing History:


Years Active: 2010-2012

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3 patents (USPTO):Explore Patents

Title: Min-hyo Park: Innovator in Semiconductor Technology

Introduction

Min-hyo Park is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor packages.

Latest Patents

One of his latest patents is a semiconductor package formed within an encapsulation. This innovation provides a semiconductor package that is compact yet includes a large number of terminals arranged at intervals equal to or greater than a minimum pitch. The package features a semiconductor chip with a bottom surface that has multiple bumps, along with redistribution layer patterns that connect electrically to these bumps. An encapsulation layer surrounds the top surface of the semiconductor chip, while a patterned insulating layer is formed below the redistribution layer patterns, exposing parts of the second parts of these patterns.

Another notable patent is the multi-chip package, which is designed to maintain stable insulation between multiple semiconductor chips while effectively dissipating heat. This package includes an insulation layer with a diamond layer created through a chemical vapor deposition method, positioned between a lead frame or heat sink and the semiconductor chips.

Career Highlights

Min-hyo Park is currently employed at Fairchild Korea Semiconductor Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor packages, making them more efficient and reliable.

Collaborations

He has collaborated with notable coworkers, including Seung-Yong Choi and Joo-yang Eom, contributing to various projects that enhance semiconductor technology.

Conclusion

Min-hyo Park is a key figure in the semiconductor industry, with a focus on developing innovative packaging solutions. His patents reflect his commitment to advancing technology in this critical field.

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