Min-Ho O

Title: **Min-Ho O: Innovator in Semiconductor Packaging Technology**

Introduction

Min-Ho O is a distinguished inventor based in Taegu-si, South Korea, recognized for his contributions to the field of semiconductor packaging. With a total of two patents to his name, O has made significant strides within the technology sector, particularly through his work at Samsung Electronics Co., Ltd.

Latest Patents

Min-Ho O's latest patents showcase his innovative thinking and technical expertise. The first patent is for a **semiconductor package embedded in substrate, system including the same and associated methods**. This invention includes a base substrate and a package that contains an encapsulated die, integrated at least partially within the substrate. The design incorporates a wiring portion that extends across adjacent portions of the substrate.

The second patent is for a **semiconductor package using chip-embedded interposer substrate**. This device features a chip with multiple chip pads mounted on a substrate, which includes redistribution pads for adapting connections. The invention utilizes bonding wires for interlinking the pads and a protective layer with via holes that expose the redistribution pads while securing the chip and substrate. This technology allows for the fabrication of semiconductor packages featuring chips of various sizes.

Career Highlights

Working at Samsung Electronics Co., Ltd., Min-Ho O has garnered experience and recognition as a key player in semiconductor innovation. His patents reflect a commitment to developing advanced materials and systems that enhance the performance and efficiency of electronic devices.

Collaborations

Min-Ho O has collaborated closely with esteemed colleagues Eun-Chul Ahn and Jong-Ho Lee. Together, this team has worked on complex projects aimed at pushing the boundaries of existing semiconductor technologies.

Conclusion

In summary, Min-Ho O is an impactful inventor whose work in semiconductor packaging proves essential for the ongoing advancements in electronic solutions. As technology evolves, his contributions continue to shape the industry, inspiring future innovations in semiconductor materials and applications.