Anyang, South Korea

Min-Gyung Kim

This inventor holds 1 USPTO granted patent. Top assignee: Lg Hausys, Ltd.. Active years: 2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min-Gyung Kim. Retrieved from https://idiyas.com/inventor/min-gyung-kim-wkff9rt4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2020

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1 patent (USPTO):Explore Patents

Title: Min-Gyung Kim and Thermoplastic Composite Innovation.

Introduction

Min-Gyung Kim is an inventor associated with Anyang, South Korea, and LG Hausys, Ltd. His patent work concerns thermoplastic composite materials and their use in panel manufacturing.

Latest Patents

Kim is named on 1 patent, titled “Thermoplastic Composite, Method for Preparing Thermoplastic Composite, and Panel.” The invention describes a composite made from a network-structured fiber material containing at least one layer of woven fiber sheet, thermoplastic resin particles measuring 1–50 μm, and particulate flame retardant. The resin particles and flame retardant are impregnated into the fiber structure. The patent also describes a panel made by thermo-compressing the composite.

Career Highlights

The available information connects Kim’s patent activity with LG Hausys, Ltd. His work focuses on combining fiber structures, thermoplastic resin, and flame-retardant particles in a composite designed for panel production.

Collaborations

Kyoung-Min Kang and Jae-Ho Lim are identified as Kim’s coworkers. The provided information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Min-Gyung Kim’s documented invention addresses the preparation and thermo-compression of a flame-retardant thermoplastic composite, highlighting his contribution to materials and panel innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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