Min Gao

Title: Min Gao and Innovations in Microvia Electroplating Evaluation

Introduction

Min Gao is a male inventor based in Hong Kong, China, associated with the Hong Kong Applied Science and Technology Research Institute. His patent work addresses the evaluation of electroplating formulations used in microvia filling, a process relevant to electronic manufacturing.

Latest Patents

The provided information lists one patent for Min Gao: “Apparatus and Method for Fast Evaluation of Electroplating Formulation Performance in Microvia Filling.” The invention describes an electrochemical analytical apparatus with a power-generating device, an electrical output signal measurement device, an electrochemical measurement device, and a motion generator. Its measurement device includes a supporting structure, a cavity, a cavity electrode, and a surface electrode.

During electroplating, the apparatus measures electrical output signals from the cavity and surface electrodes to calculate a filling performance value. The method is intended to provide a fast, accurate, and cost-effective way to compare electroplating formulations, helping users select a formulation with a high performance value for microvia filling. Gao’s listed patent portfolio comprises 1 patent.

Career Highlights

Gao’s listed work connects electrochemical measurement with practical assessment of electrolyte formulations. His patent describes an approach for evaluating filling performance before a formulation is used in an actual microvia filling process. The provided information associates him with the Hong Kong Applied Science and Technology Research Institute.

Collaborations

Yaofeng Sun and Minghui Gao are identified as Gao’s coworkers. The supplied information does not specify their roles in the patent or the invention.

Conclusion

Min Gao’s listed patent presents a measurement-based method for comparing electroplating formulations and supporting microvia filling decisions.