Gwangmyeong-si, South Korea

Min-Chul Jun


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Min-Chul Jun: Innovator in Multichip Package Testing

Introduction

Min-Chul Jun is a prominent inventor based in Gwangmyeong-si, South Korea. He is known for his significant contributions to the field of semiconductor technology, particularly in the testing of multichip packages. His innovative approach has led to the development of a unique interface board that enhances testing efficiency.

Latest Patents

Min-Chul Jun holds a patent for an interface board designed for a multichip package (MCP) test system. This patent includes a detailed description of the MCP test method utilizing the interface board. The interface board features a first surface that faces the multichip package and a second surface that faces a test apparatus. The first surface is equipped with upper terminals that connect electrically to the terminals of the multichip package. The second surface contains lower terminals that connect to the test apparatus. Notably, the upper terminals include a first upper terminal group for testing the first type of semiconductor chip and a second upper terminal group for detecting crack defects in the second type of semiconductor chip. This innovation is crucial for improving the reliability and performance of semiconductor devices.

Career Highlights

Min-Chul Jun is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His work at Samsung has allowed him to focus on advancing semiconductor testing technologies. His dedication to innovation has positioned him as a key player in the industry.

Collaborations

Min-Chul Jun has collaborated with notable colleagues, including Yun-Bo Yang and Dong-Ho Lee. Their combined expertise has contributed to the successful development of advanced testing solutions in the semiconductor field.

Conclusion

Min-Chul Jun's contributions to multichip package testing exemplify his innovative spirit and commitment to advancing technology. His patent for the interface board represents a significant step forward in semiconductor testing methodologies. Through his work at Samsung Electronics and collaborations with esteemed colleagues, he continues to make a lasting impact in the industry.

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