The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 02, 2019

Filed:

Oct. 25, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Min-Chul Jun, Gwangmyeong-si, KR;

Yun-Bo Yang, Asan-si, KR;

Dong-Ho Lee, Asan-si, KR;

Tae-Hwan Oh, Asan-si, KR;

Dong-Han Yoon, Sejong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 25/07 (2006.01); G01R 31/3185 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2893 (2013.01); G01R 31/2889 (2013.01); G01R 31/2896 (2013.01); H01L 25/074 (2013.01); H05K 1/0268 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); G01R 31/318513 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10378 (2013.01);
Abstract

In an interface board for testing a multichip package, the multichip package includes a first type semiconductor chip and a second type semiconductor chip, the interface board includes a first surface facing the multichip package and a second surface facing a test apparatus, the first surface includes upper terminals that are electrically connected to terminals of the multichip package, the second surface includes lower terminals that are electrically connected to the test apparatus, and the upper terminals include a first upper terminal group for testing the first type semiconductor chip and a second upper terminal group for testing whether a crack defect exists in the second type semiconductor chip.


Find Patent Forward Citations

Loading…