Taipei, Taiwan

Min-Chin Lin

This inventor holds 1 USPTO granted patent. Top assignee: National Applied Research Laboratories. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min-Chin Lin. Retrieved from https://idiyas.com/inventor/min-chin-lin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Min-Chin Lin and His Seismic-Resistant Coupling Structure.

Introduction

Min-Chin Lin is an inventor based in Taipei, Taiwan, associated with National Applied Research Laboratories. His work includes an invention designed to improve the seismic performance and construction efficiency of structural connections.

Latest Patents

Lin is credited with 1 patent, titled “Coupling Structure.” The invention describes a connection arranged between first and second boundary members. It includes a main coupling unit, a reinforcement unit surrounding an intermediate area of the main unit, and a concrete layer embedding both units. The design addresses challenges associated with short columns and short beams, with the stated aims of improving seismic performance and construction efficiency.

Career Highlights

Lin’s patent focuses on a structural connection intended to address practical design and construction challenges. Its combination of a reinforced coupling unit and concrete embedding is presented as a way to support more effective seismic-resistant construction.

Collaborations

Lin’s listed coworkers include Min-Lang Lin and Lap-Loi Chung. His association with National Applied Research Laboratories provides the institutional context for his work.

Conclusion

Min-Chin Lin’s “Coupling Structure” patent presents a reinforced, concrete-embedded connection intended to improve seismic performance and construction efficiency in structures involving short columns and beams.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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