Suzhou, China

Min Cao

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Tesa Se. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Min Cao. Retrieved from https://idiyas.com/inventor/min-cao-8ydqhu2j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Min Cao and His Thermal-Activated, Peelable Adhesive Tape Patent.

Introduction

Min Cao is an inventor associated with Tesa SE in Suzhou, China. His patent work includes an adhesive tape designed to become peelable when activated by heat.

Latest Patents

Cao is credited with 1 patent: “Thermal-Activated, Peelable Adhesive Tape.” The invention describes a tape with upper and lower adhesive layers, reinforcement layer or layers, and a thermally activated layer positioned between the adhesive layers. The thermally activated layer is made from a thermoplastic polymer, with possible materials including ethylene-vinyl acetate copolymer, modified polyolefin, ethylene acrylic acid copolymer, ethylene terpolymer, polyamide copolymer, poly(trans-1,4-isoprene), polyethylene oxide, or combinations of these materials. The layer may have a melting point between 60°C and 150°C and a molecular weight between 1,000 and 1,000,000.

Career Highlights

Cao’s listed patent reflects work on adhesive materials and tape construction. The design combines adhesive and reinforcement layers with a heat-responsive thermoplastic layer, enabling the tape to be peeled after thermal activation.

Collaborations

Cao’s listed coworkers include Jianxin Wang and Shuang Wang. His company affiliation is Tesa SE.

Conclusion

Min Cao’s patent describes a layered adhesive tape that uses a thermally activated polymer to support peelability, highlighting his contribution to adhesive-material innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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