This inventor holds 2 USPTO granted patents. Top assignee: United States of America as Represented by the Secretary of the Air Force. Active years: 1991-1996.
Company Filing History:
Years Active: 1991-1996
Title: Millard G Mier: Innovator in Nondestructive Measurement Techniques
Introduction
Millard G Mier is a notable inventor based in Yellow Springs, OH (US). He has made significant contributions to the field of nondestructive measurement techniques, particularly in the analysis of GaAs wafers. With a total of 2 patents, Mier's work has advanced the understanding and measurement of dislocation density in semiconductor materials.
Latest Patents
Mier's latest patents include a method for nondestructive measurement of dislocation density in GaAs and a system for automated measurement of whole-wafer etch pit density. The first patent describes a technique that tests an unetched GaAs wafer for fractional transmission of light at various points. This method allows for the calculation of the absorption coefficient and the identification of dislocation density regions without damaging the wafer. The second patent outlines a system that measures etch pit density by analyzing fractional transmission data, enabling accurate assessments of wafer quality.
Career Highlights
Millard G Mier is associated with the United States of America as Represented by the Secretary of the Air Force. His work has been instrumental in developing methods that enhance the reliability and efficiency of semiconductor manufacturing processes. Mier's innovative approaches have garnered attention in the field, contributing to advancements in material science.
Collaborations
Some of Mier's notable coworkers include David C Look and John R Sizelove. Their collaborative efforts have furthered research and development in the area of semiconductor technology.
Conclusion
Millard G Mier's contributions to nondestructive measurement techniques have made a lasting impact on the semiconductor industry. His innovative patents reflect a commitment to advancing technology and improving manufacturing processes.
