Location History:
- Irvine, CA (US) (2014)
- Bengaluru, IN (2015 - 2017)
Company Filing History:
Years Active: 2014-2017
Title: Milan Shetty: Innovator in Multi-Die Chip Module Testing
Introduction
Milan Shetty is a prominent inventor based in Bengaluru, India. He has made significant contributions to the field of semiconductor testing, particularly in the area of multi-die chip modules. With a total of 3 patents to his name, Shetty's work is recognized for its innovative approach to enhancing testing methodologies.
Latest Patents
Milan Shetty's latest patents focus on scan-based testing for multi-die chip modules (MCM). One of his notable inventions involves a multi-die chip module that comprises a first die containing a first test controller and a second die with a second test controller. These dies are coupled via an interconnect, allowing for advanced testing capabilities. The first test controller can place the first die in either a shift mode or a capture mode, while the second controller does the same for the second die. This configuration enables efficient scan-based at-speed testing of the interconnect, ensuring reliability and performance in semiconductor applications.
Career Highlights
Milan Shetty is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role involves developing innovative testing solutions that enhance the performance and reliability of multi-die chip modules. His expertise in this area has positioned him as a key contributor to the advancements in semiconductor technology.
Collaborations
Milan has collaborated with several talented individuals in his field, including Srinivasulu Alampally and Rubin Ajit Parekhji. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Milan Shetty's contributions to the field of semiconductor testing through his patents and work at Texas Instruments Corporation highlight his role as an influential inventor. His innovative approaches to multi-die chip module testing continue to shape the future of semiconductor technology.